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TSMC and Germany sign agreement to train semiconductor talents

  • 20 September, 2023
  • Filip Leskovsky
TSMC and Germany sign agreement to train semiconductor talents
TSMC has signed an agreement with the Free State of Saxony and Dresden University of Technology to train future semiconductor talent. (Photo: CNA)

The world's leading semiconductor company TSMC announced on Tuesday that it has signed an agreement with the Free State of Saxony and Dresden University of Technology to jointly train future semiconductor talent. The agreement allows 100 outstanding German students to participate in a six-month exchange program in Taiwan each year, starting from February 2024.

The program is designed for students in STEM fields and will provide them with the opportunity to learn about semiconductor manufacturing and engineering. Dresden University of Technology will coordinate the enrollment of 11 universities and the Free State of Saxony will provide financial subsidies for students participating in the exchange program.

Saxony’s science minister Sebastian Gemkow says that this program is a great opportunity for students who want to enter the semiconductor industry and will help them to develop the skills and knowledge they need to succeed in this competitive field. This exchange plan is designed with the hope of expanding cooperation in the future and opening it up to more interested institutions.

TSMC says that universities play an important role in cultivating global talents for the semiconductor industry. The company says that the program is part of its continued commitment to invest in European Semiconductor Manufacturing Company (ESMC) in Dresden, which is expected to create around 2,000 high-tech jobs by 2027.

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